Xiaomi has updated its pXRING own design sprinklers with three new models developed to boost its ecosystem connected with artificial intelligence and that include XRING 03, 3 nanometers, which will debut in the new Xiaomi 18 Fold in September.
XRING processors have been designed to drive artificial intelligence in the devices of its ecosystem that users use daily, both outside and inside the home, from mobile devices, home appliances and smart vehicles, as the company pointed out in the presentation held this Monday in China and shared through Weibo.
The update introduces the new XRING 03, 3 nanometers and with artificial intelligence, aimed at high-end mobile devices, which reaches a score of 5.22 million on AnTuTu, as highlighted by Xiaomi.
It features a large ten-core CPU, offering a 60 percent performance boost, and a GPU that debuts the G2-Ultra NX graphics processor, increasing performance by 85 percent and reducing power consumption by 64 percent.
To power Xiaomi’s intelligent platform, MIMO, it includes a low-power 4-core NPU that offers a tensor computing power of 200 TOPS and a vector computing power of 3.13 TFLOPS.
He XRING 0100 is Xiaomi’s first high-bandwidth AI acceleration chip, which the company has specifically designed for large-scale edge computing. Manufactured with a 6 nanometer process, it seeks to break the memory bottleneck generated by AI.
To do this, it has un advanced wafer-level vertical stacking packagingthe first of its kind in the industry, as highlighted by Xiaomi, which “allows processing and memory units to be stacked vertically, as if building a skyscraper, creating millions of high-speed vertical channels within the chip,” explains the company.
With this architecture, it achieves a bond pitch of 1.4 microns, and offers a bandwidth of 1.22 TB/s and an edge inference speed can reach up to 330 TPS.
XRING D100for its part, is China’s first 3nm AI chip for smart driving. It combines a 20-core high-performance CPU and a 16-core high-performance NPU, and supports up to 160 GB of unified memory to locally deploy models with up to 200 billion parameters.
Xiaomi has confirmed that production of the XRING 03 chips has already begun, which will debut on the Xiaomi 18 Fold and will also enhance the Xiaomi Mi Pad 9 Pro Maxtwo devices that the technology company will present in September.
The manufacturing phase of XRING D100 and XRING 0100 has already been completed and they are ready for commercialization next year.
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